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| ¡¡ Residual Stresses in Monolithic Multiª²Sensor
Package Abstract£ºTo investigate the sensor packaging effect£¬the finite element method is
adopted for analyzing the distribution of residual stress in the multiª²sensor chip with
FR4 substrates£®The variability of the residual stress is investigated by changing the
adhesive with different Young¡¯s modulus£¬ the thickness and fillet height parameters£®The
experiment of the monolithic multiª²sensor package is performed£® The simulatied results
are compared with the experimental ones£® The results show that the packageª²induced
residual stress can be reduced by decreasing the Young¡¯s modulus of the adhesive£¬
increasing the thickness and fillet height of the adhesive£® |
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