| ¡¡ Study on Forced Air Convection Cooling for
Electronic Assemblies
Li Bin£¬Tao Wenquan£¬He Yaling
(State Key Laboratory of Muliphase Flow in Power Engineering£¬Xi'an¡¡Jiaotong¡¡University£¬Xi'an
¡¡710049£¬China)
Abstract£ºIn the present work£¬ the slotted fin concept was employed to improve the air
cooling performance for heat sinks of plateª²fin type. Numerical simulations of laminar
heat transfer and flow pressured drop were conducted for the integral plate fin£¬discrete
plate fin, and discrete slotted fin heat sinks. It is found that the performance of the
discrete plate fin is better than that of integral plate fin and the performance of
slotted fin is better than that of discrete plate fin based on the same pumping power of
the fan. Then a new type of heat sink was proposed£¬which is characterized by discrete
and slotted fin surface with thinner fin height and shorter fin spacing. Preliminary
computation shows that this type of heat sink may be useful for the next generation of CPU
of higher thermal load with an efficient fan. The issue of the limit of airª²cooling
techniques was also analysed.
Keywords£ºelectronic assemblies; heat sink; slotted fin; discrete fin |
