Modeling of Thermally Induced Error for
High-Precision Step Imprint Tool
Yan Le, Lu Bingheng, Ding Yucheng, Liu Hongzhong
(State Key Laboratory for Manufacturing Systems Engineering, Xi'an Jiaotong University,
Xi'an 710049, China)
Abstract: Thermally induced error during the exposure process is a major contribution
to the repeatable alignment accuracy of the step imprint tool in imprint lithography
system. A modeling based on the multiple regression analysis was proposed for the
real-time prediction of thermally induced errors with multiple temperature measurements,
and the measurement points were reduced from 15 to 6. The experimental results show that
the method accurately predicts the time-variant thermally induced error under different
condition, the error predicting veracity reaches to 89% in ª«xª« direction and 93% in
ª«zª« direction. As a highly accurate predictor, this method solves the difficulties of
the variable coupling.
Keywords: imprint lithography; step imprint tool; thermally induced error; temperature
field; mod-eling