Cao Zongjie,Wang Jiuhong,Xue Jin,Wang Yuwen
(School of Material Science and Engineering,Xi'an Jiaotong University,Xi'an 710049,Chian)
Abstract:The C scan image of the interface between β Al2O3 ceramic and aluminum bonded by field-assisted diffusion bonding was obtained by ultrasonic C scan imaging method and binarized by histogram maximum entropy method.The bonded ratio of the interface, which was calculated from the C scan image, linearly increases with the increase in the shearing strength of the samples.It is proved that bonded ratio is an important parameter to evaluate the bonding quality.The bonding qualities of the interfaces between K4 glass and aluminum bonded by field-assisted diffusion bonding were evaluated by this method. It shows that the increase in the voltage of electric field and bonding temperature results in an increase in the bonded ratio and so improves the bonding quality.The result indicates that the investigated method is efficient for the quality evaluation of the interface of field-assisted diffusion bonding, particularly the bonding of brittle materials with-low strength.
Keywords:field-assisted diffusion bonding;ultrasonic nondestructive testing;bonded ratio